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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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PFS7523 Datenblatt(PDF) 15 Page - Power Integrations, Inc. |
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PFS7523 Datenblatt(HTML) 15 Page - Power Integrations, Inc. |
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15 / 36 page  Rev. A 06/15 15 PFS7523-7529/7533-7539 www.power.com The value of resistor R5 will have to be adjusted in some designs and as a guideline the value from the following calculation can be used: P O Maximum continuous output power in watts. V O Nominal PFC output voltage in volts. C O PFC output capacitance in farads. Figure 15. Heat Sink Assembly – using Thermally Conductive Adhesive. 1 5 3 4 2 (2X) 2. Screw 1. Heat Sink 4. HiperPFS-3 3. Thermally Conductive Adhesive 5. Eyelet Terminal − Electrical Connection to Heat Sink Heat Sinking and Thermal Design Figures 15, 16, 17 show an example of the recommended assembly for the HiperPFS-3. In this assembly, no insulation pad is required and HiperPFS-3 can be directly connected to the heat sink by mechanical clip or adhesive thermal compound. The HiperPFS-3 back metal is electrically connected to the heat sink and the heat sink is required to be connected to the HiperPFS-3 source terminal in order to reduce EMI. |
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