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Vishay BCcomponents

Revision: 14-Dec-16

4

Document Number: 28405

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ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS



ACCORDING TO JEDEC J-STD-020

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

• Temperature measuring point on top of the case and on terminals.

• Max. 2 runs with pause of min. 30 min in between.

REFLOW SOLDERING CONDITIONS for MAL216099xxxE3

PROFILE FEATURES

CASE CODE

1213 TO 1216

CASE CODE

1616 TO 1821

Max. time from 25 °C to TPeak

300 s

300 s

Max. ramp-up rate to 150 °C

3 K/s

3 K/s

Max. time from 150 °C to 200 °C (t1)

150 s

150 s

Max. time from 190 °C to 200 °C (t2)

110 s

110 s

Ramp up rate from 200 °C to TPeak

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

Max. time above TLiquidus (217 °C) (t3)

90 s

90 s

Max. time above 230 °C (t4)

65 s

60 s

Peak temperature TPeak

250 °C

245 °C

Max. time above TPeak minus 5 °C

30 s

30 s

Ramp-down rate from TLiquidus

3 K/s to 6 K/s

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4