M95128-R datasheet(37/48 Pages) STMICROELECTRONICS

Teilenummer	M95128-R

Bauteilbeschribung	128-Kbit serial SPI bus EEPROM with high-speed clock

PDF	48 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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37 / 48 page

10.3

UFDFPN8 (DFN8) package information

UFDFPN8 is an 8-lead, 2 × 3 mm, 0.55 mm thickness ultra thin profile fine pitch dual flat package.

Figure 27. UFDFPN8 - Outline

Top view

Pin #1

ID marking

Side view

Seating plane

eee

ccc

1 2

aaa

Datum A

Terminal tip

Detail “A”

Even terminal

e/2

Pin #1

ID marking

Bottom view

See Detail “A”

1 2

ND-1 x

Maximum package warpage is 0.05 mm.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

Drawing is not to scale.

The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

M95128-W M95128-R M95128-DF

UFDFPN8 (DFN8) package information

DS1356 - Rev 20

page 37/48

M95128-R Datenblatt(PDF) 37 Page - STMicroelectronics