2000 Mar 07

9

Philips Semiconductors

Product specification

Hex buffer with open-drain outputs

74LVC07A

PACKAGE OUTLINES

UNIT

A

max.

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

7

8

1

14

y

076E06

MS-012

pin 1 index

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

97-05-22

99-12-27

0

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1