Revision 2.2

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3.0

Package Specifications

Figure 3-1. 292-Terminal TEPBGA (Body Size: 27x27x2.33 mm; Pitch: 1.27 mm)

NOTES: UNLESS OTHERWISE SPECIFIED.

1)

SOLDER BALL COMPOSITION: SN 63%, PB 37%.

2)

DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.

3)

THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.

4)

REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAL-1.