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SL2ICS20 Datenblatt(PDF) 7 Page - NXP Semiconductors |
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SL2ICS20 Datenblatt(HTML) 7 Page - NXP Semiconductors |
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7 / 12 page ![]() Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification SL2 ICS 20 7 8 FINAL WAFERTEST SPECIFICATION • Minimum yield per wafer: 30% of 35416 potential good dies. • Minimum yield per lot: 30% |
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