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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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80KSW0004 Datenblatt(PDF) 42 Page - Renesas Technology Corp |
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80KSW0004 Datenblatt(HTML) 42 Page - Renesas Technology Corp |
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42 / 48 page  42 of 47 March 31, 2008 IDT80KSW0004 Datasheet 20 Package Specifications Package Physical & Thermal Specifications Package: Super FlipChip FCBGA (AR324) Dimensions: 19 x 19 mm Ball Count: 324 Ball Diameter: 0.6mm Ball Pitch: 1.0mm Estimated Theta JA = {18.2C/W @ 0m/s, 11.1 C/W @ 1m/s, 9.4 C/W @ 2m/s} Estimated Theta JC = 0.2 C/W VDD 1.2V Digital Power (CMOS) Digital VDD. All pins must be tied to single potential power supply plane. VDD3 3.3V Digital Power (CMOS) Digital Interface VDD. All pins must be tied to single potential power supply plane. VDDA Analog Power (CMOS) Analog power. VDDS & VDDA may be tied to a common power plane. VDD (core, digital supply) should have its own supply and plane. VDDS SERDES Power (CMOS) Analog power for TX/RX pairs. VDDS & VDDA may be tied to a common power plane. VDD (core, digital supply) should have its own supply and plane. Pin Name Function Supply / Interface Pin Function Description Table 36 Pin Summary (Alphabetical) |
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