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HCS10MS Datenblatt(PDF) 8 Page - Renesas Technology Corp |
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HCS10MS Datenblatt(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCS10MS FN2435 Rev 0.00 Page 8 of 8 September 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20mm x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS10MS A1 VCC C1 B1 (2) A2 (3) B2 (4) C2 (5) (6) (7) (8) (9) A3 (10) B3 (11) C3 (12) Y1 (1) (14) (13) Y2 GND Y3 |
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