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HCS154MS Datenblatt(PDF) 8 Page - Renesas Technology Corp |
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HCS154MS Datenblatt(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCS154MS FN2479 Rev 3.00 Page 8 of 8 January 6, 2011 Die Characteristics DIE DIMENSIONS: 85 x 101 mils 2.16 x 2.57mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: 2.0 x 105A/cm2 BOND PAD SIZE: 100µm x 100µm 4 x 4 mils Metallization Mask Layout HCS154MS Y0 (1) Y1 (2) Y2 (3) Y3 (4) Y4 (5) Y5 (6) Y6 (7) Y7 (8) Y8 (9) Y9 (10) (11) Y10 (12) GND (13) Y11 (14) Y12 (15) Y13 (21) A2 (20) A3 (19) E2 (18) E1 (17) Y15 (16) Y14 VCC (24) A0 (23) A1 (22) |
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