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HCS193MS Datenblatt(PDF) 9 Page - Renesas Technology Corp |
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HCS193MS Datenblatt(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() HCS193MS FN3065 Rev 1.00 Page 9 of 9 September 1995 Die Characteristics DIE DIMENSIONS: 104 x 86 mils 2642 m x 2185m METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS193MS P1 (1) Q1 (2) Q0(3) GND (8) P3 (9) (15) P0 VCC (16) P2 (10) CPD(4) CPU(5) Q2(6) Q3(7) (14) MR (13) TCD (12) TCU (11) PL |
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