| Datenblatt-Suchmaschine für elektronische Bauteile |
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HCS32DMSR Datenblatt(PDF) 9 Page - Renesas Technology Corp |
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HCS32DMSR Datenblatt(HTML) 9 Page - Renesas Technology Corp |
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9 / 11 page ![]() HCS32MS FN3057 Rev 1.00 Page 9 of 11 April 11, 2007 Die Characteristics DIE DIMENSIONS: 87milsx88 mils 2.20mmx2.2mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4milsx4mils Metallization Mask Layout HCS32MS A1 VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (6) (7) (8) (9) A3 (10) B3 (11) Y4 (12) A4 (1) (14) (13) Y2 GND Y3 |
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