4

AMCC Confidential and Proprietary

Revision A – August 12, 2004

Data Sheet

S3160 – 2.5 Gbps Wide Bandwidth Transimpedance Amplifier

Figure 3. S3160 Bonding Pad Location

Note: Pad Size is 94

µm X 94 µm. The exposed area of the pad is 80 µm X 80 µm.

Die thickness is 254

1. The circuit die size is the smallest possible size of the die. The lower left-hand corner of the circuit die is the

origin of the xy-coordinate system. Pad coordinates indicated in Table 1 are measured from this origin to the

pad's center.

2. The total die size is the largest possible size of the die. It includes a splicing area around the circuit die. The

actual size of any given die may vary in size from the minimum (circuit die) size to the maximum (total die)

size.

VCC

RBYPASS

IIN

RBYPASS

GND

GND

GND

GND

OUTN

OUTP

FILT

VCC

VCC

VCC

VCC

12

3

4

5

6

7

8

9

10

11

12

13

14

15

1.15 mm (Circuit Die Size)

1.27 mm (Total Die Size)

X-Axis

Y-Axis