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BFS25 Datenblatt(PDF) 3 Page - NXP Semiconductors

Teilenummer BFS25
Bauteilbeschribung  NPN 5 GHz wideband transistor
PDF  11 Pages
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Hersteller  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BFS25 Datenblatt(HTML) 3 Page - NXP Semiconductors

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December 1997
3
Philips Semiconductors
Product specification
NPN 5 GHz wideband transistor
BFS25A
THERMAL RESISTANCE
Note
1. Ts is the temperature at the soldering point of the collector tab.
CHARACTERISTICS
Tj =25 °C, unless otherwise specified.
Note
1. GUM is the maximum unilateral power gain, assuming S12 is zero and
SYMBOL
PARAMETER
CONDITIONS
THERMAL RESISTANCE
Rth j-s
thermal resistance from junction to
soldering point
up to Ts = 170 °C; note 1
190 K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ICBO
collector cut-off current
IE = 0; VCB =5 V
−−
50
nA
hFE
DC current gain
IC = 0.5 mA; VCE = 1 V
50
80
200
Cre
feedback capacitance
IC = 0; VCB = 1 V; f = 1 MHz
0.3
0.45
pF
fT
transition frequency
IC = 1 mA; VCE = 1 V; f = 1 GHz;
Tamb =25 °C
3.5
5
GHz
GUM
maximum unilateral power gain
(note 1)
IC = 0.5 mA; VCE = 1 V; f = 1 GHz;
Tamb =25 °C
13
dB
F
noise figure
Γ
s = Γopt;IC = 0.5 mA; VCE =1 V;
f = 1 GHz; Tamb =25 °C
1.8
dB
Γ
s = Γopt;IC = 1 mA; VCE =1 V;
f = 1 GHz; Tamb =25 °C
2
dB
G
UM
10 log
S
21
2
1S
11
2


1S
22
2


--------------------------------------------------------------
dB.
=



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