S72WS-P_00_A4 May 29, 2006

S72WS-P based MCP/PoP Products

9

Da t a

Sh ee t

( A dv an c e

In f o r m at io n)

4.

Ordering Information

The order number is formed by a valid combinations of the following:

S72WS

512

P

D0

HF

0

L

G

0

PACKING TYPE

0 = Tray

2 = 7” Tape and Reel

3 = 13” Tape and Reel

MODEL NUMBER 2

G = 66MHz/133MHz Speed, No Data Flash

H = 66MHz/133MHz Speed, Spansion MS-P as Data Flash

J = 66MHz/133MHz Speed, NAND Type 1 as Data Flash

R = 80MHz/104MHz Speed, No Data Flash

D = 80MHz/133MHz Speed, Spansion MS-P as Data Flash

E = 80MHz/133MHz Speed, NAND Type 1 as Data Flash

MODEL NUMBER 1

L = x16 DDR DRAM Type 5

G = x16 DDR DRAM Type 1

H = x16 DDR DRAM Type 2

1 = x16 SDR DRAM Type 2

PACKAGE DESCRIPTOR

Depends on Character 12. For a more detailed description see Table 4.1.

PACKAGE TYPE & MATERIAL SET

HF = 1.2mm MCP FBGA, Pb-free

KF = 1.2mm POP FBGA, Pb-free

JF = 1.4mm MCP FBGA, Pb-free

DRAM & ORNAND FLASH DENSITY

D0 = 128 Mb DRAM, No Data Flash

EF = 256Mb DRAM, 512Mb NAND Flash

FF = 512Mb DRAM, 512Mb NAND Flash

E0 = 256Mb DRAM, No Data Flash

PROCESS TECHNOLOGY

P = 90 nm, MirrorBit

CODE FLASH DENSITY

256 = 256Mb

512 = 512Mb

PRODUCT FAMILY

S72WS Stacked Products (MCP/PoP)

1.8 V NOR Flash and ORNAND Flash on Bus 1 with Mobile DRAM on Bus 2

Table 4.1 Character Position Descriptions (Sheet 1 of 2)

Character 12

Character 13

Character 14 Description

Package Area

Package Ball Count

Raw Ball Size

H, J, or G

07x9 mm

56

0.35 mm

17x9 mm

80

2

8x11.6 mm

64

3

8x11.6 mm

84

4

9x12 mm

84

5

9x12 mm

115

6

9x12 mm

137

7

11x13 mm

84

8

11x13 mm

115

9

11x13 mm

137