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LM1771SSDX Datenblatt(PDF) 13 Page - National Semiconductor (TI) |
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LM1771SSDX Datenblatt(HTML) 13 Page - National Semiconductor (TI) |
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13 / 18 page ![]() MOSFET Selection (Continued) 20189034 It can be seen that the average output voltage (V OUT_AC- TUAL ) is higher than the output voltage (V OUT_SET) that was calculated by the earlier equation by exactly half the output voltage ripple. The output voltage that is targeted for regu- lation may then be appended according to the voltage ripple. This can be seen below: V OUT_ACTUAL=VOUT_SET + 1 ⁄2 ∆V OUT =VOUT_SET + 1 ⁄2 ∆I L x R ESR Efficiency Calculations One of the most important parameters to calculate during the design stage is the expected efficiency of the system. This can help determine optimal FET selection and can be used to calculate expected temperature rise of the individual com- ponents. The individual losses of each component are bro- ken down and the equations are listed below: QUIESCENT CURRENT The quiescent current consumed by the LM1771 is one of the major sources of loss within the controller. However, from a system standpoint this is usually less than 0.5% of the overall efficiency. Therefore, it could easily be omitted but is shown for completeness: P IQ =VIN xIQ CONDUCTION LOSS There are three losses associated with the external FETs. From the DC standpoint there is the I-squared R loss, caused by the on resistance of the FET. This can be mod- eled for the PMOS by: P P_COND =DxRDSON_PMOS xIOUT 2 and the NMOS by: P N_COND =(1-D)xRDSON_NMOS xIOUT 2 SWITCHING LOSS The next loss is the switching loss that is caused by the need to charge and discharge the gate capacitance of the FETs every cycle. This can be approximated by: P P_SWITCH =VIN xQg_PMOS xfSW for the PMOS, and the same approach can be adapted for the NMOS: P N_SWITCH =VIN xQg_NMOS xfSW TRANSITIONAL LOSS The last FET power loss is the transitional loss. This is caused by switching the PMOS while it is conducting current. This approach only models the PMOS transition, the NMOS loss is considered negligible because it has minimal drain to source voltage when it switches due to the conduction of the body diode. Therefore the transitional loss of the PMOS can be modeled by: P P_TRANSITIONAL =0.5xVIN xIOUT xfSW x(tr +tf) t r and tf are the rise and fall times of the FET and can be found in their corresponding datasheet. Typically these num- bers are simulated using a 6 Ω drive, which corresponds well to the LM1771. Given this, no adjustment is needed. DCR LOSS The last source of power loss in the system that needs to be calculated is the loss associated with the inductor resistance (DCR) which can be calculated by: P DCR =RDCR xIOUT 2 EFFICIENCY The efficiency, η, can then be calculated by summing all the power losses and then using the equation below: Thermals By breaking down the individual power loss in each compo- nent it makes it easy to determine the temperature rise of each component. Generally the expected temperature rise of the LM1771 is extremely low as it is not in the power path. Therefore the only two items of concern are the PMOS and the NMOS. The power loss in the PMOS is the sum of the conduction loss and transitional loss, while the NMOS only has conduction loss. It is assumed that any loss associated with the body diode conduction during the dead-time is negligible. For completeness of design it is important to watch out for the temperature rise of the inductor. Assuming the inductor is kept out of saturation the predominant loss will be the DC copper resistance. At higher frequencies, depending on the core material, the core loss could approach or exceed the DCR losses. Consult with the inductor manufacturer for ap- propriate temp curves based on current. www.national.com 13 |
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