Nexperia

74LVC2G34

Dual buffer gate

12. Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT363-2

SC-88A

MO-203

sot363-2_po

21-12-15

21-12-16

Unit

mm max

min

1.1

0.1

0.30 0.25 2.2

0.65 1.3

A

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

TSSOP6: plastic thin shrink small outline package; 6 leads; body width 1.25 mm

SOT363-2

A1

A2

1.0

A3

bp

c

D(1) E(1)

e

e1

HE

Lp

v

w

0.15

0.1

0.3

0.1

y

1.15

1.8

0.26

0

0.8

0.15 0.08 1.8

0.8

0°

1.35

2.4

0.46

8°

θ

0

3 mm

scale

w

B

M

D

e

e

e1

A

A1

c

(6x)

A3

A2

Lp

detail X

HE

E

v M A

A

B

y

X

1

3

2

4

5

6

pin 1 index

θ

bp

(6x)

Fig. 10. Package outline SOT363-2 (TSSOP6)

74LVC2G34

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© Nexperia B.V. 2022. All rights reserved

Product data sheet

Rev. 12 — 20 January 2022

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