REF192ESZ datasheet(15/28 Pages) AD

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REF19x Series

Rev. I | Page 15 of 28

ABSOLUTE MAXIMUM RATINGS

Table 24.

Parameter1

Rating

Supply Voltage

−0.3 V, +18 V

Output to GND

−0.3 V, VS + 0.3 V

Output to GND Short-Circuit Duration

Indefinite

Storage Temperature Range

PDIP, SOIC_N Package

−65°C to +150°C

Operating Temperature Range

REF19x

−40°C to +85°C

Junction Temperature Range

PDIP, SOIC_N Package

−65°C to +150°C

Lead Temperature Range (Soldering 60 sec)

300°C

1 Absolute maximum ratings apply to both DICE and packaged parts, unless

otherwise noted.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 25. Thermal Resistance

Package Type

θJA1

θJC

Unit

8-Lead PDIP

103

°C/W

8-Lead SOIC_N

158

°C/W

1 θJA is specified for worst-case conditions; that is, θJA is specified for the device

in socket for PDIP and is specified for the device soldered in the circuit board

for the SOIC package.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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