| Datenblatt-Suchmaschine für elektronische Bauteile |
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UPC1944J Datenblatt(PDF) 12 Page - Renesas Technology Corp |
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UPC1944J Datenblatt(HTML) 12 Page - Renesas Technology Corp |
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12 / 13 page ![]() Data Sheet G10239EJ4V0DS 10 μ PC1943,1944 μPC1944GR : 8PIN PLASTIC SOP (5.72 mm (225)) Process Conditions Symbol Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 3 time. IR35-00-3 VPS Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time. WS60-00-1 Partial Heating Method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (per each side of the device). P350 μPC1944GR-A : 8PIN PLASTIC SOP (5.72 mm (225)) Process Conditions Symbol Infrared ray reflow Peak temperature: 260 °C or below (Package surface temperature), Reflow time: 60 seconds or less (at 220 °C or higher), Maximum number of reflow processes: 3 time. IR60-00-3 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time. WS60-00-1 Partial Heating Method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (per each side of the device). P350 Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. Type of Through-hole Device μPC1944J, 1944J-A : 3PIN PLASTIC SIP (TO-92) Process Conditions Symbol Wave soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Maximum number of flow processes: 1 time, WS60-00-1 Partial Heating Method Pin temperature: 350°C or below, Heat time: 3 seconds or less (per each pin). P350 Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. REFERENCE DOCUMENTS Review of Quality and Reliability Handbook Information C12769E Semiconductor Device Mount Manual http://www.necel.com/pkg/en/mount/index.html <R> <R> |
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