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MCP6071 Datenblatt(PDF) 36 Page - Microchip Technology |
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MCP6071 Datenblatt(HTML) 36 Page - Microchip Technology |
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36 / 42 page ![]() MCP6071/2/4 DS20002142C-page 36 2009-2021 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 0.65 BSC MIN E MAX Contact Pad Length (Xnn) Contact Pad Width (Xnn) Y X 1.45 0.45 NOM C Contact Pad Spacing 5.90 Contact Pad to Contact Pad (Xnn) G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C X Y G E SILK SCREEN 14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP] Microchip Technology Drawing C04-2087 Rev D |
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