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PLUS16R6DN Datenblatt(PDF) 9 Page - NXP Semiconductors

Teilenummer PLUS16R6DN
Bauteilbeschribung  PAL devices
PDF  16 Pages
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Hersteller  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PLUS16R6DN Datenblatt(HTML) 9 Page - NXP Semiconductors

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TEMPERATURE
Maximum junction
Maximum ambient
Allowable thermal
rise ambient to
junction
150
°C
75
°C
75
°C
Philips Semiconductors Programmable Logic Devices
Product specification
PLUS16R8D/-7 SERIES
PAL devices
16L8, 16R8, 16R6, 16R4
September 10, 1993
44
ABSOLUTE MAXIMUM RATINGS1
THERMAL RATINGS
RATINGS
SYMBOL
PARAMETER
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
+7
VDC
VIN
Input voltage
–1.2
+8.0
VDC
VOUT
Output voltage
–0.5
VCC + 0.5V
VDC
IIN
Input currents
–30
+30
mA
IOUT
Output currents
+100
mA
Tstg
Storage temperature range
–65
+150
°C
NOTE:
1. Stresses above those listed may cause malfunction or permanent damage to the device. This
is a stress rating only. Functional operation at these or any other condition above those
indicated in the operational and programming specification of the device is not implied.
OPERATING RANGES
RATINGS
SYMBOL
PARAMETER
MIN
MAX
UNIT
VCC
Supply voltage
+4.75
+5.25
VDC
Tamb
Operating free–air temperature
0
+75
°C



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