IRS2181/IRS21814(S)PbF

www.irf.com

2

Symbol

Definition

Min.

Max.

Units

High-side floating absolute voltage

-0.3

620

(Note 1)

High-side floating supply offset voltage

High-side floating output voltage

Low-side and logic fixed supply voltage

-0.3

20

(Note 1)

Low-side output voltage

-0.3

Logic input voltage (HIN & LIN)

Logic ground (IRS21814 only)

Allowable offset supply voltage transient

—

50

V/ns

(8-lead PDIP)

—

1.0

(8-lead SOIC)

—

0.625

(14-lead PDIP)

—

1.6

(14-lead SOIC)

—

1.0

(8-lead PDIP)

—

125

Thermal resistance, junction to ambient

(8-lead SOIC)

—

200

(14-lead PDIP)

—

75

(14-lead SOIC)

—

120

Junction temperature

—

150

Storage temperature

-50

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

V

°C/W

W

°C

DT97-3 for more details).

VB

High-side floating supply absolute voltage

High-side floating supply offset voltage

Note 2

600

High-side floating output voltage

Low-side and logic fixed supply voltage

10

20

Low-side output voltage

0

Logic input voltage (HIN & LIN)

Logic ground (IRS21814 only)

-5

5

Ambient temperature

-40

125

°C

V

Symbol

Definition

Min.

Max.

Units

Recommended Operating Conditions

The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the

Note 1: All supplies are fully tested at 25 V and an internal 20 V clamp exists for each supply.