PESDXUSB30_SER

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Nexperia B.V. 2016. All rights reserved.

Product data sheet

Rev. 2 — 26 April 2016

12 of 19

Nexperia

PESDxUSB30 series

ESD protection for differential data lines

Fig 16. Package outline WLCSP10

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PESD2USB30

pesd2usb30_po

Unit

mm

max

nom

min

0.60

0.38

1.62

1.52

1.22

A

Dimensions (mm are the original dimensions)

WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)

PESD2USB30

A1

b

0.31

DE

e

e1

e2

0.80

0.57

0.37

1.57

1.17

0.40

0.40

e3

0.80

0.26

0.54

0.36

1.12

0.21

0

1 mm

scale

16-01-19

detail X

A

A1

X

A

B

C

E

D

e2

e1

B2

B1

bump A1

index area

bump A1

index area

e

b

4

3

e3

2

1

1/2 e