6 (9)

DA1175.008

13 July, 2006

SOLDERING INFORMATION

N For Sn/Pb MSOP-10

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20 2*220°C

Maximum Temperature

240°C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in JESD22-A113 should not

Seating Plane Co-planarity

max 0.08 mm

Lead Finish

Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%

N For Pb Free, RoHS Compliant MSOP-10

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20

Maximum Temperature

260°C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in IPC/JEDEC J-STD-020

Lead Finish

Solder plate 7.62 - 25.4 µm, material Matte Tin