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M41T62 Datenblatt(PDF) 35 Page - STMicroelectronics |
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M41T62 Datenblatt(HTML) 35 Page - STMicroelectronics |
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35 / 40 page ![]() M41T62/63/64/65 Package mechanical information 35/40 6 Package mechanical information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 26. QFN16 – 16-lead, Quad, Flat Package, no Lead, 3x3mm body size, outline 1. Drawing is not to scale. A3 A A1 e K K b Ch D2 E2 L E D 1 2 ddd 3 QFN16-A C |
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