1998 Dec 04

4

Philips Semiconductors

Product specification

Fast soft-recovery controlled

avalanche rectifiers

BYD53 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.17.

For more information please refer to the

‘General Part of associated Handbook’.

maximum slope of reverse

recovery current

see Fig.19

BYD53D to J

−−

7A/

µs

BYD53K and M

−−

6A/

µs

BYD53U and V

−−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

60

K/W

thermal resistance from junction to ambient

note 1

120

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

dI

R

dt

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