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LM317KCS Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer LM317KCS
Bauteilbeschribung  3-TERMINAL ADJUSTABLE REGULATOR
PDF  22 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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LM317KCS Datenblatt(HTML) 2 Page - Texas Instruments

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ADJUST
OUTPUT
INPUT
Absolute Maximum Ratings
(1)
Package Thermal Data
(1)
LM317
3-TERMINAL ADJUSTABLE REGULATOR
SLVS044R – SEPTEMBER 1997 – REVISED APRIL 2007
SCHEMATIC DIAGRAM
over virtual junction temperature range (unless otherwise noted)
MIN
MAX
UNIT
VI – VO
Input-to-output differential voltage
40
V
TJ
Operating virtual junction temperature
150
°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
260
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
BOARD
θ
JA
θ
JC
θ
JP
(2)
PowerFLEX™ (KTE)
High K, JESD 51-5
23
°C/W
3
°C/W
SOT-223 (DCY)
High K, JESD 51-7
53
°C/W
30.6
°C/W
TO-220 (KC/KCS)
High K, JESD 51-5
19
°C/W
17
°C/W
3
°C/W
TO-263 (KTT)
High K, JESD 51-5
25.3
°C/W
18
°C/W
1.94
°C/W
(1)
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(2)
For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX™,
θ
JP is defined as the thermal resistance
between the die junction and the bottom of the exposed pad.
2
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