STTH112U datasheet(3/7 Pages) STMICROELECTRONICS

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STTH112

Electrical characteristics

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Figure 3.

Relative variation of thermal

impedance junction ambient versus

pulse duration (epoxy FR4,

Lleads = 10mm) (DO-41).

Figure 4.

Relative variation of thermal

impedance junction ambient versus

pulse duration (epoxy FR4) (SMA).

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Figure 5.

Relative variation of thermal

impedance junction ambient versus

pulse duration (epoxy FR4)(SMB).

Figure 6.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

circuit board FR4, copper

thickness: 35 µm) (DO-41, SMB).

Figure 7.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

circuit board FR4, copper

thickness: 35 µm) (SMA).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-c)

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

(°C/W)

th(j-a)

100

110

012

34567

S(cm²)

DO-41

=10mm

leads

SMB

(°C/W)

th(j-a)

100

110

120

130

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

SMA

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