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SMPJ556 Datenblatt(PDF) 4 Page - InterFET Corporation |
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SMPJ556 Datenblatt(HTML) 4 Page - InterFET Corporation |
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4 / 4 page ![]() 4 of 4 www.InterFET.com J556-7 Document Number: IF35327.R01 InterFET Corporation November, 2021 InterFET Product Folder Technical Support Order Now Order Now J556-7 TO-92-2L Mechanical and Layout Data Package Outline Data Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations. |
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