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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TMF8701 Datenblatt(PDF) 7 Page - OSRAM GmbH |
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TMF8701 Datenblatt(HTML) 7 Page - OSRAM GmbH |
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7 / 66 page  Page 6 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Absolute Maximum R atings Note(s): 1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non hermetic Solid State Surface Mount Devices.” Temperature Ranges and Storage Conditions TSTRG Storage Temperature -40 85 °C RHNC Relative Humidity (non-condensing) 85 % TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD-020(1) MSL Moisture Sensitivity Level 3 Represents a maximum floor life time of 168h with TAMB<30°C and <60% r.h. Symbol Parameter Min Max Units Comment |
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