AD9516-2SLASHPCBZ datasheet(16/84 Pages) AD

16 / 84 page

AD9516-2

Rev. 0 | Page 16 of 84

ABSOLUTE MAXIMUM RATINGS

Table 18.

Parameter or Pin

With

Respect To

Rating

VS, VS_LVPECL

GND

−0.3 V to +3.6 V

VCP

GND

−0.3 V to +5.8 V

REFIN, REFIN

GND

−0.3 V to VS + 0.3 V

REFIN

−3.3 V to +3.3 V

RSET

GND

−0.3 V to VS + 0.3 V

CPRSET

GND

−0.3 V to VS + 0.3 V

CLK, CLK

GND

−0.3 V to VS + 0.3 V

CLK

−1.2 V to +1.2 V

SCLK, SDIO, SDO, CS

GND

−0.3 V to VS + 0.3 V

OUT0, OUT0, OUT1,OUT1,

OUT2, OUT2, OUT3, OUT3,

OUT4, OUT4, OUT5, OUT5,

OUT6, OUT6, OUT7, OUT7,

OUT8, OUT8, OUT9, OUT9

GND

−0.3 V to VS + 0.3 V

SYNC

GND

−0.3 V to VS + 0.3 V

REFMON, STATUS, LD

GND

−0.3 V to VS + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

1 See Table 19 for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE1

Table 19.

Package Type

θJA

Unit

64-Lead LFCSP

°C/W

ESD CAUTION

1 Thermal impedance measurements were taken on a 4-layer board in still air

in accordance with EIA/JESD51-7.

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