n North America: Tel. (800) 366-2266, Fax (800) 618-8883

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

Specifications subject to change without notice.

Visit www.macom.com for additional data sheets and product information.

V 2.0

Handling Procedures

The following precautions should be observed to avoid

damaging these devices.

Cleanliness

These devices should be handled in a clean environment. Do

not attempt to clean die after installation.

ESD

These devices very susceptible to ESD and are rated Class 0

(0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF

ESD, they must be handled in a static-free environment.

General Handling

The protective polymer coating on the active areas of these

devices provides scratch protection, particularly for the metal

airbridge that contacts the anode.

Die can be handled with

tweezers or vacuum pickups and are suitable for use with

automatic pick-and-place equipment.

Silicon Flip Chip PIN Diode

MA4FCP200

Mounting Techniques

These devices were designed for insertion onto hard or soft

substrates with the junction side down. They can be mounted

with conductive epoxy or with a low temperature solder

preform. The die can also be assembled with the junction side

up, and wire or ribbon bonds made to the pads.

Solder Die Attach

Solder that does not scavenge gold, such as Indalloy #2, is

recommended. Sn-Pb based solders are not recommended due

to solder embrittlement. Do not expose die to a temperature

greater than 235

seconds. No more than three seconds of scrubbing should be

required for attachment.

Epoxy Die Attach

Assembly can be preheated to 125 to 150

amount of silver epoxy.

Cure epoxy as per manufacturer’s

schedule. For extended cure times, temperatures should be kept

below 200

0

1

2

3

4

5

0

200

400

600

800

1000

FREQUENCY (MHz)

10mA

50mA

100mA

Typical Performance Curves @ +25°C

1

Current and Frequency

0.000

0.005

0.010

0.015

0.020

0.025

0

200

400

600

800

1000

FREQUENCY (MHz)

-10V

0V

Voltage and Frequency

Absolute Maximum Ratings

1

Parameter

Absolute Maximum

Forward Current

2

125 mA

Reverse Voltage

-70 V

Operating Temperature

-55°C to +150°C

Storage Temperature

-55°C to +150°C

Dissipated Power

2

145 mW

Mounting Temperature

+235°C for 10 seconds

1. Exceeding these limits may cause permanent damage.

package with conductive silver epoxy..

2

Applications

These devices are well suited as series diodes in broadband

multi-throw switches through 26 GHz. In addition, the excep-

tional RC product makes them useful as shunt switches at milli-

meter frequencies. The low parasitic values of L and C make

additional circuit tuning unnecessary.