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TUSB564 Datenblatt(PDF) 49 Page - Texas Instruments |
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TUSB564 Datenblatt(HTML) 49 Page - Texas Instruments |
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49 / 54 page ![]() NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4225901/A 05/2020 www.ti.com VQFN - 1 mm max height RGF0040F PLASTIC QUAD FLATPACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 12X METAL SOLDER MASK OPENING SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (4.8) (3.7) (5.7) 36X (0.5) 40X (0.6) 40X (0.25) (6.8) 2X (1.25) 2X (1.35) 2X (0.625) 2X (0.975) (Ø 0.2) VIA TYP (R 0.05) TYP 12 1 40 33 32 21 20 13 41 www.ti.com TUSB564-Q1 SLLSFO9 – MAY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links: TUSB564-Q1 |
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