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Case: Molded Plastic

Terminals: Plated Leads Solderable Per MIL

STD-202, Method 208

Weight: 5.4 grams (approx.)

Mounting position: Through Hole for #6

Screw

Mechanical Data:

Maximum Ratings and Electrical Characteristics

Diffused Junction

High Current Capability

High Case Dielectric Strength

High Surge Current Capability

Ideal for Printed Circuit Board Application

Plastic Material has Underwriters

Laboratory Flammability Classification 94V-0

Features:

Reverse Voltage: 50 ~ 1000 Volts

Forward Current: 10 Amp

MP1000-G THRU MP1010-G (RoHS Device)

Silicon Bridge Rectifiers

“-G” suffix designated RoHS compliant version

Min.

14.73

5.80

19.00

5.11

3.60

10.30

Max

15.75

6.90

-

6.14

4.00

11.30

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate currently by 20%.

Characteristics

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMS Reverse Voltage

Non-Repetitive Peak Forward Surge Current 8.3ms Single

Half-sine-wave superimposed on rated load (JEDEC

Method)

Rating for Fusing (t<8.3ms) (Note2)

Typical Thermal Resistance (Note4)

Operating and Storage Temperature Range

Typical Junction Capacitance (Note3)

MP

1000-G

50

35

MP

1001-G

100

70

MP

1002-G

200

140

MP

1004-G

400

280

10

200

1.1

10

1.0

64

7.5

-55 to +160

110

UNIT

V

V

A

A

V

uA

A2S

K/W

ºC

pF

Symbol

KBP

1006-G

600

420

KBP

1008-G

800

560

KBP

1010-G

1000

700

Note:

1. Non-repetitive for t>1ms and <8.3ms.

2. Thermal resistance junction to ambient mounted on PC board with 13.0 x 13.0 x 0.03 mm thick land areas.

3. Measured at 1.0MHz and applied reverse voltage of 4.0V D.C.

4. Thermal resistance junction to case per element.

Dim

A

B

C

D

E

G

J

I

KBP

All Dimensions in mm

MP-10

Hole for #6 screw

+

~

~

-

J

H

G

E

A

E

C

B

D

Metal Heat Sink