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MPC8280CVRP Datenblatt(PDF) 74 Page - Freescale Semiconductor, Inc |
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MPC8280CVRP Datenblatt(HTML) 74 Page - Freescale Semiconductor, Inc |
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74 / 80 page ![]() MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 74 Freescale Semiconductor Package Description 9.2 Mechanical Dimensions Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU) package. Refer to Table 2. Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA Dim Millimeters Min Max A1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. 4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls. |
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