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MPC8541ECPXAPE Datenblatt(PDF) 73 Page - Freescale Semiconductor, Inc

Teilenummer MPC8541ECPXAPE
Bauteilbeschribung  PowerQUICC??III Integrated Communications Processor Hardware Specifications
PDF  84 Pages
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Hersteller  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8541ECPXAPE Datenblatt(HTML) 73 Page - Freescale Semiconductor, Inc

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MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
73
Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package. Figure 46 and provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 46. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence



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