| Datenblatt-Suchmaschine für elektronische Bauteile |
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627T Datenblatt(PDF) 2 Page - Bi technologies |
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627T Datenblatt(HTML) 2 Page - Bi technologies |
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2 / 4 page ![]() MODEL 627 T Model 627 T Series www.bitechnologies.com www.irctt.com www.welwyn-tt.com General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics’ own data and is considered accurate at time of going to print. © TT electronics plc 06.12 Lead Material Copper alloy, 96-96.5% Sn, 3.5-4% Ag Lead Configuration Gull Wing Lead Coplanarity ±0.002 in. (0.057mm) Substrate Material Alumina Resistor Material Cermet Body Material Epoxy Mechanical Outline dimensions (inch/mm) Schematic .050 1.27 .016 0.41 .310 7.87 Max. .220 ± .005 5.59 ± 0.13 Typ. .028 0.71 Typ. .008 0.20 Typ. .095 2.41 Max. Typ. .395 10.03Max. .008 0.20 .015 0.38 Typ. Note: Maximum allowable mold excursion = 0.006” 50 50 50 50 50 50 50 50 50 50 50 50 125 125 125 125 125 125 |
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