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RF2498
Rev A4 070308
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A
A
A
A
A
A
A
A
B
B
B
B
B
B
B
B
A
A
A
A
A
A
A
A
B
B
B
B
B
B
B
B
C
3.50 Typ.
0.50 Typ.
0.50 Typ.
0.55 Typ.
1.75 Typ.
1.75 Typ.
0.55 Typ.
3.50 Typ.
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 3.60 (mm) Sq.
Pin 1
Pin 32
Pin 24
Pin 16
Dimensions in mm.
Figure 2. PCB Solder Mask Pattern (Top View)
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