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M24256E-F Datenblatt(PDF) 35 Page - STMicroelectronics |
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M24256E-F Datenblatt(HTML) 35 Page - STMicroelectronics |
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35 / 46 page ![]() Note: The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash, but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash, protusions or gate burrs is bottom side. Figure 23. TSSOP8 – Footprint example 1.55 5.80 7.35 1. Dimensions are expressed in millimeters. M24256E-F TSSOP8 package information DS12687 - Rev 3 page 35/46 |
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