1996 Nov 22

8

Philips Semiconductors

Product specification

Baseband delay line

TDA4663T

PACKAGE OUTLINE

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

91-08-13

95-01-23

076E07S

MS-012AC

0.069

0.0098

0.0039

0.057

0.049

0.01

0.019

0.014

0.0098

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.24

0.23

0.028

0.020

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

0

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1