SS32 − S310

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ABSOLUTE MAXIMUM RATINGS Values are at TA = 25°C unless otherwise noted.

Symbol

Parameter

Value

Units

SS32 SS33 SS34 SS35 SS36 SS38 SS39 S310

VRRM

Maximum Repetitive Reverse Voltage

20

30

40

50

60

80

90

100

V

IF(AV)

Maximum Average Forward Current

at TA = 75°C

3.0

A

IFSM

Non−Repetitive Peak Forward Surge Current:

8.3 ms Single Half−Sine Wave

100

A

dV/dt

Maximum Voltage Rate of Change

10000

V/mS

TSTG

Storage Temperature Range

−55 to +150

°C

TJ

Operating Junction Temperature

−55 to +150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

THERMAL CHARACTERISTICS

Symbol

Parameter

Value

Unit

PD

Power Dissipation

2.27

W

RθJA

Thermal Resistance, Junction to Ambient (Note 1)

55

°C/W

RθJL

Thermal Resistance, Junction to Lead

17

°C/W

1. Device mounted on FE−4 PCB 0.55 x 0.55 inch (14 x 14 mm).

ELECTRICAL CHARACTERISTICS Values are at TA = 25°C unless otherwise noted.

Symbol

Parameter

Test Conditions

Value

Units

SS32 SS33 SS34 SS35 SS36 SS38 SS39 S310

VF

Forwarded Voltage

IF = 3.0 A

500

750

850

mV

IR

Reverse Current at Rated VR

TA = 25°C

0.5

mA

TA = 100°C

20

10

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

TYPICAL CHARACTERISTICS

Figure 1. Forward Current Derating Curve

Figure 2. Non−Repetitive Surge Current

0

25

50

75

100

125

150

175

0

1

2

3

Number of Cycles at 60 Hz

Ambient Temperature (5C)

Resistive or Inductive

Load P.C.B. Mounted

on 0.55 x 0.55’’

(14 x 14) mm

Copper Pad Areas

1

2

5

20

50

100

10

0

60

80

100

40

20