Jul23-07 Rev K

SP69 High Current Power Switch

© 2007 Sipex Corporation

2

AbSOLUTE MAxIMUM RATINgS

RECOMMENDED OPERATINg CONDITIONS

These are stress ratings only and functional op-

eration of the device at these ratings or any other

above those indicated in the operation sections of

the specifications below is not implied. Exposure to

absolute maximum rating conditions for extended

periods of time may affect reliability.

PARAMETER

CONDITIONS

MIN

TYP (Note )

MAX

UNITS

Operating Input Voltage

Range

2.5

7

V

Overcurrent Deactivation

Range

EN=1.5V

725

800

00

mA

Overcurrent Duration Be-

fore Deactivation

EN=1.5V



5.25

ms

Shutdown Supply Current

2

µA

Quiescent Supply Current

350

µA

Quiescent Supply Current

5.25

mA

EN=1.5V

.377

Ω

Post Fault Output Load for

Recovery

Enable=1.5V

0

5

23

KΩ

Post Fault Activation Turn

On Time

Enable=1.5V



55

ms

Thermal Shutdown Die

Temperature

SP69 will self recover

when temperature drops

below the trip point .

20

50

80

°C

Thermal Restart Die Tem-

perature

90

20

35

°C

ENABLE Logic LOW

Driver is disabled

.5

V

ENABLE Pin Logic HIGH

Driver is active

.655

.4

V

Turn On Delay

(Note 2,3)

600

µs

Turn Off Delay

(Note 2,4)

200

µs

Rise Time

(Note 2)

00

µs

Fall Time

(Note 2)

2500

µs

Storage Temperature..…....……….… -65°C to 50°C

Junction Temperature..................... ……..…….50°C

Lead Temperature (Soldering, 0 sec)......…….300°C

ESD RATING

Human Body Model……………………….…….2000V

Machine Model…………………………………....200V

OPERATING RATINGS

Thermal resistance SOT23-6

Junction to Ambient……………………….….….9°C

Junction to lead ……………………...……………50°C

Note 2: Characterized, not 100% tested

Note 3: Turn on delay is measured from the time the enable pin is turned on to the time it takes the output to rise to 10% of its

final value.

Note 4: Turn off delay is measured from the time the enable pin is turned to the time it takes for the output to fall to 90% of its

current value.