PS200

DS21891B-page 28

© 2005 Microchip Technology Inc.

6.2

Package Details

The following sections give the technical details of the

packages.

20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

10.92

9.40

7.87

.430

.370

.310

eB

Overall Row Spacing

§

0.56

0.46

0.36

.022

.018

.014

B

Lower Lead Width

1.65

1.52

1.40

.065

.060

.055

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.56

3.30

3.05

.140

.130

.120

L

Tip to Seating Plane

26.42

26.24

26.04

1.040

1.033

1.025

D

Overall Length

6.60

6.35

6.10

.260

.250

.240

E1

Molded Package Width

8.26

7.87

7.49

.325

.310

.295

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

3.68

3.30

2.92

.145

.130

.115

A2

Molded Package Thickness

4.32

3.94

3.56

.170

.155

.140

A

Top to Seating Plane

2.54

.100

p

Pitch

20

20

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

1

2

D

n

E1

c

β

eB

E

α

p

A2

L

B1

B

A

A1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-019

§ Significant Characteristic