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ZXFV302EV Datenblatt(PDF) 2 Page - Zetex Semiconductors |
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ZXFV302EV Datenblatt(HTML) 2 Page - Zetex Semiconductors |
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2 / 3 page ![]() PCB design A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Board – artworks and NC drill output can be provided if required). ZXFV302EV SEMICO NDUC TORS ISSUE 1 - SEPTEMBER 2004 2 Figure 2 Evaluation circuit top copper layout (overall dimensions 2.5 x 2.25 inches) Figure 3 Evaluation board bottom copper layout (viewed through from top) |
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