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LEAP2MQ Datenblatt(PDF) 10 Page - OSRAM GmbH |
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LEAP2MQ Datenblatt(HTML) 10 Page - OSRAM GmbH |
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10 / 21 page ![]() LE A P2MQ DATASHEET DATASHEET 10 | Version 1.4 | 2024-07-02 Dimensional Drawing 7) Further Information: Approximate Weight: 5,000.0 mg ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. Notes: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. Connector: Molex Pico-SPOX™ Wire-to-Board Header, Part Number 87438-1043 Recommended mating connector: Molex Pico-SPOX™ Wire-to-Board Housing, Part Number 87439-1000 Crimp Terminal, Part Number 87421-0000 |
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