Datenblatt-Suchmaschine für elektronische Bauteile
  German  ▼
ALLDATASHEETDE.COM

X  

PACE1754 Datenblatt(PDF) 2 Page - Pyramid Semiconductor Corporation

Teilenummer PACE1754
Bauteilbeschribung  SINGLE CHIP, 40MHz CMOS PROCESSOR INTERFACE CIRCUIT (PIC)
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Hersteller  PYRAMID [Pyramid Semiconductor Corporation]
Direct Link  http://www.pyramidsemiconductor.com
Logo PYRAMID - Pyramid Semiconductor Corporation

PACE1754 Datenblatt(HTML) 2 Page - Pyramid Semiconductor Corporation

  PACE1754 Datasheet HTML 1Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 2Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 3Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 4Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 5Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 6Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 7Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 8Page - Pyramid Semiconductor Corporation PACE1754 Datasheet HTML 9Page - Pyramid Semiconductor Corporation Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 20 page
background image
PACE1754
Page 2 of 20
Document # MICRO-5 REV C
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage Range
0.5V to +7.0V
Input Voltage Range
0.5V to VCC + 0.5V
Storage Temperature Range
–65°C to +150°C
Input Current Range
–30mA to +5mA
Current applied to any output3
150mA
Maximum Power Dissipation2
1.5W
Lead Temperature Range
(soldering 10 seconds)
300°C
Thermal resistance (
θJC):4
Cases X and T
8°C/W
Cases Y and U
5°C/W
Case Z
6°C/W
Notes:
1. Stresses above the absolute maximum rating may cause
permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2. Must withstand the added power dissipation due to short circuit
test e.g., IOS.
3. Duration 1 second or less.
4. Device Type Definitions from 5962-88642 SMD:
Case X: Dual In-Line
Case T: Dual In-Line with Gull-Wing Leads
Case Y: Leaded Chip Carrier with Gull-Wing Leads
Case U: Leaded Chip Carrier with Unformed Leads
Case Z: Pin Grid Array
RECOMMENDED OPERATING
CONDITIONS
Case Temperature
GND
VCC
–55°C to +125°C
0
4.5V to +5.5V



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


Datenblatt Download

Go To PDF Page


Link URL



War ALLDATASHEET hilfreich?  [ DONATE ] 

Über Alldatasheet   |   Werbung   |   Kontakt   |   Privatsphäre und Datenschutz   |   Link zum Datenblatt    |   Linktausch   |   Hersteller
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com