www.ti.com

EXAMPLE STENCIL DESIGN

32X (0.55)

32X (0.2)

28X (0.4)

(3.85)

(3.85)

4X (

1.23)

(R0.05) TYP

(0.715)

(0.715)

VQFN - 1 mm max height

RSM0032B

PLASTIC QUAD FLATPACK - NO LEAD

4219108/B 08/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

33

SYMM

METAL

TYP

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 33:

77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

SYMM

1

8

9

16

17

24

25

32