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Bumping Process Specifics

Amkor’s bumping process is production certified in the

full package size range, from WLCSP up through large

die Flip Chip BGA (FCBGA).

All factories are ISO/TS16949 certified.

Wafer Bumping

Wafer Size

200 mm, 300 mm

Solder

Compositions

98.2 Sn/1.8 Ag

(All Available As Low Alpha:

<0.002 cts/hr/cm2),

SnAgCu, Doped Alloys

Pad Pitch

Lower Limit

50~500+ μm

Repassivation

Coatings

Polyimide, PBO, Low Cure Polymers

Redistribution

Materials

Plated Copper

Related Processes/Services

Wafer bumping and WLCSP use many of the same basic

process steps in production. Key WLCSP developments

have resulted in improved wafer level technology

known as CSPnl.

CSPnl combines plated copper technology and advanced

photopolymers to produce the industry’s most robust

wafer level solutions. CSPnl is available down to 0.3 mm

pitch and supports a range of solder volumes to meet

customer requirements.

Closely related to both bumping and WLP production

is “die processing” capability, which consists of process

steps that transform either bumped or WLCSP product

from wafer form into die form.

Die processing typically involves backgrind, backside

coat, test, singulation, inspection, tape and reel, and

pick-and-place. Amkor offers these full turnkey services

to support our customers in China (C3), Korea (K5),

Portugal (E1) and Taiwan (T3/T6) factories.