6.4 Thermal Information OPA863A

THERMAL METRIC(1)

OPA863A

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

191.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

122.9

°C/W

RθJB

Junction-to-board thermal resistance

91.6

°C/W

ΨJT

Junction-to-top characterization parameter

65.5

°C/W

ΨJB

Junction-to-board characterization parameter

91.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information OPA2863A

THERMAL METRIC(1)

OPA2863A

UNIT

D (SOIC)

DGK

(VSSOP)

DSN (USON)

8 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

120.0

180.3

52.4

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

63.3

67.5

41.7

°C/W

RθJB

Junction-to-board thermal resistance

63.2

101.9

25.5

°C/W

ΨJT

Junction-to-top characterization parameter

17.2

9.8

0.6

°C/W

ΨJB

Junction-to-board characterization parameter

62.5

100.1

25.5

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

N/A

N/A

8.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA863A, OPA2863A

SBOSA95G – MAY 2022 – REVISED DECEMBER 2024

Copyright © 2024 Texas Instruments Incorporated

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