5

TP2635/TP2640

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

8-Lead SOIC Package Outline (LG)

45°

5° - 15°

(4 PLCS)

4.90 ± 0.10

1.27BSC

6.00 ± 0.20

3.90 ± 0.10

Notes:

1. All dimensions in millimeters. Angles in degrees.

2. If the corner is not chamfered, then a Pin 1 identifier

must be located within the area indicated.

Note 2

1.75 MAX

0.10 - 0.25

0.31 - 0.51

1.25 MIN

0.25 - 0.50

0° - 8°

0.40 - 1.27

0.17 - 0.25

Top View

Side View

End View

Note 2

1

8

3-Lead TO-92 Package Outline (N3)

1 2 3

Seating Plane

1

2

3

Front View

0.175 - 0.205

0.170 - 0.210

0.500 MIN

0.014 - 0.022

0.045 - 0.055

0.095 - 0.105

0.125 - 0.165

0.135 MIN

0.080 - 0.105

0.014 - 0.022

Side View

Bottom View

Notes:

All dimensions are in millimeters; all angles in degrees.

Doc.# DSFP-TP2635_TP2640

C032807