| Datenblatt-Suchmaschine für elektronische Bauteile |
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TMP110 Datenblatt(PDF) 32 Page - Texas Instruments |
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TMP110 Datenblatt(HTML) 32 Page - Texas Instruments |
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32 / 44 page ![]() www.ti.com PACKAGE OUTLINE C 0.525 0.435 0.22 0.16 0.4 TYP 0.8 TYP 6X 0.27 0.23 0.4 TYP B E A D 4231071/A 07/2024 D: Max = 0.980 mm, Min = 0.920 mm DSBGA - 0.525 mm max height YBG0006-C04 DIE SIZE BALL GRID ARRAY E: Max = 1.518 mm, Min = 1.458 mm NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE 0.05 C A 1 2 0.015 C A B SYMM SYMM B 3 SCALE 13.000 TMP113 SBOSAJ5 – DECEMBER 2024 www.ti.com 32 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TMP113 |
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